Preparation and Thermal Properties of Silicon-containing Polyimide Composite Films
You, Lifeng
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How to Cite

You L., 2017, Preparation and Thermal Properties of Silicon-containing Polyimide Composite Films , Chemical Engineering Transactions, 59, 1051-1056.
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Abstract

Aromatic polyimide is a kind of polymer material with high temperature resistance, low temperature resistance, radiation resistance, excellent chemical stability, excellent electrical properties and good mechanical strength. It has been widely used in aerospace, electrical and electronic fields. At present, the synthesis, properties and application of polyimide containing silicon is one of the hot spots in the research field of polyimide. The processing property of polyimide can be greatly improved by introducing silicon group or polysiloxane segment into the main chain structure. And it has been given a good solubility, permeability, impact resistance, UV resistance and anti-degradation in oxygen rich environment. The introduction of siloxane chain segments or silicon containing groups in polyimide framework can enhance the adhesion between polyimide and inorganic materials, including the adhesion of metal materials and other substrates. A variety of polyimide hybrid materials can be prepared by the excellent bonding properties. A series of polyimide / silicon containing polyimide / BaTiO3 nanocomposite films were prepared and their structures and properties were studied in this paper. In addition, the preparation, structure and properties of polyimide / mesoporous silica composite films were studied. Silicon containing polyimide/silane mesoporous silica composite films have low infrared emissivity compared with bulk polyimide. Under the same content of mesoporous silica, the composite films prepared by copolymerization have lower infrared emissivity. Moreover, the infrared emissivity decreases with the increase of the content of silica. In short, silicon containing polyimides and their composite films with excellent performance differ from other traditional polyimides, and it has broad application prospects in the technological field of aerospace, electrical and electronic, gas separation, absorbing material preparation.
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