Impact of Cu Content on Corrosion Property of Zn20Sn Lead- free Solder
Wang, Qiumin
Mou, Hongxia
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How to Cite

Wang Q., Mou H., 2017, Impact of Cu Content on Corrosion Property of Zn20Sn Lead- free Solder , Chemical Engineering Transactions, 62, 259-264.
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Abstract

By alloying principle, different contents of Cu were added in the matrix Zn20Sn filler metals to form a new type of alloy, the effects of Cu contents on the Zn20Sn solder alloy corrosion resistance were studied. The results show that when the Cu content is less than 4%, with the increase of Cu content, Zn20SnxCu solder alloy corrosion potential increased and corrosion rate reduced gradually, the corrosion resistance of solder alloy increased. When the Cu content is more than 4%, with the increase of Cu content, Zn20SnxCu solder alloy corrosion potential reduced and corrosion rate increased gradually, the corrosion resistance of solder alloy reduced. Main products on the corrosion surface of Zn20SnxCu are Zn5(OH)8Cl2.H2O and ZnO. Under the consideration of the corrosion performance of Zn20SnxCu, the best addition amount of Cu is 4%.
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